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e.MMC-Based MCP

Our e.MMC-Based MCPs do more than meet the memory requirements of mid-tier phones, tablets, auto infotainment systems and smart watches. They save more than 40% space versus discrete memory—reducing the memory footprint, simplifying PCB design, and speeding time to market. Built on a foundation of Micron-manufactured e.MMC (MLC/TLC NAND + microcontroller) and LPDRAM, these JEDEC-compliant, footprint-compatible devices enable simple and flexible system design and certification.

By Density

Managed NAND Density DRAM Type DRAM Density Voltage Package
16GB LPDDR3 8Gb, 16Gb, 24Gb 3.3V, 1.8V VFBGA, TFBGA
32GB LPDDR3 24Gb, 32Gb, 16Gb 3.3V TFBGA, LFBGA
4GB LPDDR3, LPDDR2 8Gb, 4Gb 3.3V VFBGA
8GB LPDDR3, LPDDR2 8Gb 3.3V VFBGA, WFBGA
View Full e.MMC-Based MCP Part Catalog

By Application

EmbeddedLearn More about our Embedded Solutions
Compact Footprint

Compact Footprint

Squeeze more performance into your space-constrained designs with stacked memory devices.

Reliability

Reliability

Rely on products that are rigorously tested and qualified through close collaboration with OEMs.

Documentation

Frequently Asked Questions
Multichip Packages FAQs
Frequently asked questions (FAQs) about Micron's Multichip Packages.
  • Updated: 09/30/2015
Customer Service Note
Product Marks, Product Labels, and Packaging Labels
The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.
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  • File Type: PDF
  • Updated: 03/23/2016
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